Today’s 200mm wafer production demands reliable, accurate and fast wafer probing solutions. Our 200mm automated wafer probers are based on the production-proven Horizon platform to meet these demands for high-volume, low-cost manufacturing, as well as leading-edge, multi-die and bumped wafer applications.
The 4090µ+, our top 200mm prober, is available as an upgrade to 4080, 4090, and 4090µ probers to extend the advanced applications of your 200mm tools and maximize your investment!
Key features and available upgrades of our EG 4000 series Horizon probers are;
- Probe camera optics and an advanced vision system greatly increase probe card alignment speed.
- Accuracy up to +/-3µ for 4090µ+.
- Supports 4″, 6″, and 8″ wafers in both thin and standard thicknesses.
- High Voltage testing upgrades, for testing power products.
- MicroTouch™, a technology that allows probers to delicately control the speed of Z motion for handling Cu and Low K Dielectric devices.
- Closed Loop handler upgrades, for improved reliability.
- Scripted scrub and brush upgrades for cleaning probe needles while the machine is automatically running, keeping throughput high without reducing yield.
- Thermal Agility, our term designating probers with the ability to quickly heat up or cool down the chuck top between -55°C and 155°C for temperature testing.