The EG6000 is our best prober offering, meeting your needs of high volume, high accuracy manufacturing with ease!
Leading-edge 300mm wafer production demands wafer probing that can address shrinking geometries and deliver extremely accurate, high-throughput for fine-pitch probing applications and advanced devices with copper interconnects and low-k dielectrics that require special handling. Designed with customers’ production challenges in mind, our 300mm wafer probers provide reliable, accurate, high-throughput production capability for real-world test environments.
EG6000 Prober Key Benefits for your sort floor;
- Low maintenance and high mean time between failures or adjustment with extremely high test repeatability.
- +/- 1.5µ accuracy via precision direct-drive technology.
- Active vibration cancellation to ensure consistent contact resistance.
- Our EG6000 Probers are able to rapidly test between a temperature range of {-65°C and 200°C}, resuming probing as soon as the desired chuck temperature is reached using Thermal Agility.
- Our EG6000 probers use MicroTouch™ to control velocity and deceleration of the chuck top to reduce the impact of the probe pins on pads, allowing floors to test sensitive copper and low K dielectric devices.
